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CPU GPU Gap Filling Material Thermally Conductive Electrical Insulation Silicone Pad for Heatsink Cooling

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CPU GPU Gap Filling Material Thermally Conductive Electrical Insulation Silicone Pad for Heatsink Cooling

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Brand Name : Ziitek

Model Number : TIS100-05 Series

Certification : UL & RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/pcs

Delivery Time : 3-6 work days

Packaging Details : 24*23*12CM

keyword : Electrical Insulation

application : CPU GPU Gap Filling

continous use temp : -45 to 180℃

compliance : UL & RoHS

materials : Ceremic filled silicone elastomer

feature : High thermal conductive and High dielectric etrength

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CPU GPU Gap Filling Material Thermally Conductive Electrical Insulation Silicone Pad for Heatsink Cooling

Company pfrofile

With professional R&D capabilities and over 18 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

CPU GPU Gap Filling Material Thermally Conductive Electrical Insulation Silicone Pad for Heatsink Cooling

Products details:

TIS100-05 Series products are the high-efficiency insulation ones with thermal conduction properties.The supplement of the insulation base film made by silica gel into the heat-conduction material creates a great effect on both the insulation and heat conduction.​

TIS100-05-Serice-Datasheet-REV01.pdf

CPU GPU Gap Filling Material Thermally Conductive Electrical Insulation Silicone Pad for Heatsink Cooling


Features:


> High thermal conductive and High dielectric etrength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures


Applications:


> Car Battery & Power Supply
> Power semiconductors:To packages, MOSFETs & IGBTs
> Audio and Video components
> Automotive control units
> Motor controllers

Typical Properties of TIS100-05 series
Product Name TIS109-05 TIS112-05 TIS118-05 Test Method
Color blue Visual
Construction &Compostion Ceramic filled silicone elastomer / Fiberglass *******
Composite Thickness 0.23mm 0.3mm 0.45mm ASTM D374
Hardness 50 Shore 00 ASTM D751
Specific Gravity 1.72g/cc ASTM D297
Tensile Strength 425 Kpsi ASTM D412
Continuous Use Temp -45 to 180℃ *******
Dielectric Breakdown Voltage >3500 VAC ASTM D149
Dielectric Constant 5.5 MHz ASTM D150
Volume Resistivity 4.0X10¹³ Ohm-meter ASTM D257
Flame Rating 94 V0 E331100
Thermal conductivity 1.0 W/mK ASTM D5470

Standard Thicknesses:
0.009"(0.228mm)0.012"(0.304mm)0.018"(0.457mm)

Consult the factory alternate thickness.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.

Request adhesive on doule side with "A2" suffix.

Standard Sizes:
12" x 160"(304mm x 48.76M)
lndividual die cut shapes can be supplied.

Packaging Details & Lead time

The packaging of thermal insulation materials

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.


Product Tags:

Heatsink Cooling Silicone Pad

      

Thermally Conductive Electrical Insulation Silicone Pad

      

CPU GPU Silicone Pad

      
Best CPU GPU Gap Filling Material Thermally Conductive Electrical Insulation Silicone Pad for Heatsink Cooling wholesale

CPU GPU Gap Filling Material Thermally Conductive Electrical Insulation Silicone Pad for Heatsink Cooling Images

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